Frear, Darrel: search on Z-Library

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1

Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders

Jang, Jin-Wook, De Silva, Ananda P., Drye, James E., Post, Steve L., Owens, Norman L., Lin, Jong-Kai, Frear, Darrel R.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2007

Language:

english

File:

PDF, 3.65 MB

english, 2007

2

A study of the effect of precipitated austenite on the fracture of a ferritic cryogenic steel

Darrel Frear, J. W. Morris

Journal:

Metallurgical and Materials Transactions A

Year:

1986

Language:

english

File:

PDF, 2.76 MB

english, 1986

3

Foreword

Srinivas Chada, Darrel Frear, Sungho Jin, Sung K. Kang, C. Robert Kao, Martin Weiser

Journal:

Journal of Electronic Materials

Year:

2002

Language:

english

File:

PDF, 41 KB

english, 2002

4

Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions

Xin Long, Indranath Dutta, Vijay Sarihan, Darrel R. Frear

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 1.30 MB

english, 2008

5

Foreword

Sung K. Kang, Iver Anderson, Srini Chada, Jeng-Gong Duh, Laura J. Turbini, Albert Wu, C. Robert Kao, Fay Hua, K. N. Subramanian, Darrel Frear, Carol Handwerker, Fu Guo, Nik Chawla, Kejun Zeng

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 70 KB

english, 2009

6

Tensile behavior of pb-sn solder/cu joints

Lenora Quan, Darrel Frear, Dennis Grivas, J. W. Morris

Journal:

Journal of Electronic Materials

Year:

1987

Language:

english

File:

PDF, 2.92 MB

english, 1987

7

The effect of Cu6Sn5whisker precipitates in bulk 60sn-40pb solder

Darrel Frear, Dennis Grivas, J. W. Morris

Journal:

Journal of Electronic Materials

Year:

1987

Language:

english

File:

PDF, 2.67 MB

english, 1987

8

The formation of Cu3Sn intermetallic on the reaction of cu with 95Pb-5Sn solder

Dennis Grivas, Darrel Frear, Lenora Quan, J. W. Morris

Journal:

Journal of Electronic Materials

Year:

1986

Language:

english

File:

PDF, 970 KB

english, 1986

9

Optoelectronic interconnections and packaging: A materials challenge

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

1994

Language:

english

File:

PDF, 340 KB

english, 1994

10

Materials and mechanics issues of solder alloy applications

Ken Kinsman, Darrel R. Frear, Wendell B. Jones

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

1990

Language:

english

File:

PDF, 759 KB

english, 1990

11

Issues in the replacement of lead-bearing solders

Paul T. Vianco, Darrel R. Frear

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

1993

Language:

english

File:

PDF, 1.80 MB

english, 1993

12

Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Jang, Jin-Wook, De Silva, Ananda P., Lin, Jong-Kai, Frear, Darrel R.

Journal:

Journal of Materials Research

Year:

2004

Language:

english

File:

PDF, 2.90 MB

english, 2004

13

Microstructural Observations and Mechanical Behavior of Pb-Sn Solder on Copper Plates

Frear, Darrel, Grivas, Dennis, Quan, Lenora, Morris, J. W.

Journal:

MRS Proceedings

Year:

1986

Language:

english

File:

PDF, 2.40 MB

english, 1986

14

SPIE Proceedings [SPIE Metallization: Performance and Reliability Issues for VLSI and ULSI - San Jose, United States (Thursday 12 September 1991)] Metallization: Performance and Reliability Issues for VLSI and ULSI - Effect of Cu at Al grain boundaries on electromigration behavior in Al thin films

Frear, Darrel R., Michael, Joseph R., Kim, C., Romig, Jr., A. D., Morris, Jr., J. W., Gildenblat, Gennady S., Schwartz, Gary P.

Year:

1991

Language:

english

File:

PDF, 1.32 MB

english, 1991